LDX Optronics combines over 35 years of semiconductor laser expertise with advanced manufacturing processes to deliver customizable, high-performance multimode diodes. Our end-to-end capabilities span wafer-level design to packaging, ensuring reliability and flexibility for industrial, medical, defense, and space applications.
Contact RPMC Lasers - Our Exclusive Distributor - To Discuss Your Requirements:
LDX's Extensive Wavelength Range:
We offer one of the broadest wavelength portfolios in the industry, powered by high-efficiency broad-area, gain-guided multimode designs.
| Visible | 405-750 nm | Near-IR | 750-1400 nm | SWIR | 1400-1900 nm |
|---|---|---|
| 405, 445, 520, 622, 630, 635, 645, 650, 660, 665, 672, 680, 685, 690, 725, 735, 740, 750 nm | 760, 775, 780, 785, 792, 797, 808, 825, 830, 835, 860, 870, 880, 905, 915, 940, 960, 980, 995, 1015, 1030, 1064, 1130, 1210, 1280, 1310, 1370 nm | 1470, 1550, 1620, 1640, 1675, 1850, 1900 nm |
|
Free-Space
Fiber-Coupled |
Free-Space
Fiber-Coupled |
Free-Space
Fiber-Coupled |
LDX's Superior Packaging Options
Our packaging expertise ensures high thermal efficiency for better performance and lifetimes.
Standard Packages:
| Free-Space Packages - Exposed Emitter | ||
|---|---|---|
| Package Name | Features | Options |
|
C-Mount Package
|
Small footprint w/ screw mounting
Material - Copper (OFHC)
Fast-axis lensing
|
Fast-axis lensing
|
|
B-Mount Package
|
Very small footprint
Requires soldering to heatsink
Material - Copper Tungsten (CuW)
|
Fast-axis lensing
|
|
Chip-on-Submount
|
Very small footprint
Requires soldering to heatsink
Material - BeO
|
Fast-axis lensing
|
| Free-Space Packages - Hermetically Sealed Windowed Packages | ||
|---|---|---|
| Package Name | Features | Options |
|
9mm Package
|
Industry-leading package
Header material - Copper
|
Photodiode
Isolated package
Fast-axis lensing
|
|
TO-3 Package
|
Mounting to heatsink w/ screws
Header material - Copper
|
TEC
Thermistor
Photodiode
Fast-axis lensing
|
|
HHL Package
|
Internal Peltier cooler (TEC),
Thermistor
Photodiode
Header material - copper
|
Fast-axis lensing
|
| Fiber-Coupled Packages - Hermetically Sealed | ||
|---|---|---|
| Package Name | Features | Options |
|
9mm SMA FC Package
|
Industry-standard package
SMA connector for detachable fiber
Header material - Copper
|
Photodiode
Isolated package
|
|
8-Pin BFC Package
|
Built-in internal TEC
Photodiode
Fiber pigtail w/ SMA connector
Header material - Copper
|
Thermistor
|
|
2-Pin FCP Package
|
Fiber pigtail w/ SMA connector
Header material - Copper
|
none
|
|
HHL-FC Package
|
Fiber pigtail w/ SMA connector
Internal TEC
Thermistor & Photodiode
Header material - Copper
|
none
|
- Advanced thermal management: Low thermal resistance for improved lifetimes
- Optional TEC, photodiode, or aiming beam available in some packages
Custom Packaging:
If one of our standard packages is not what you need, let us know! We can help!
LDX's Flexible Fast-Axis Collimation (FAC) Lensing Options:
Our lensing expertise ensures the light is where you need it.
- Standard Fast-axis collimation (FAC) Options:Best Collimation – Less than 1° divergence in the fast axis directionSquared Beam – Matches the fast-axis to the slow-axis divergence
- Tailored Fast-axis collimation (FAC):You provide the specifications needed
LDX's Advanced Soldering Techniques:
Soldering is selected and executed for optimal thermal/electrical performance and application-specific reliability.
- Flux/void-free, high-precision bonding for minimal thermal resistance
- Soft solder (In): Preferred for best thermal resistance
- Hard solder (AuSn): Preferred for high-temperature, or when additional soldering steps are required.
LDX's Robust Hermetic Sealing Technology:
Hermetic sealing protects diodes enabling long-duration operation in harsh environments.
- Hermetically sealed window packages prevent moisture/contamination ingress
LDX's Tailored Solutions:
- Electrically isolated options mitigate grounding conflicts (e.g., positive package on negative-ground systems)
- Devices designed for vacuum, radiation, and thermal extremes
- Emitting Area (Emitters)Most wavelengths are available in 50, 100, 150, and 300 um emittersIf you need something different, let us know.
Custom Packaging:
- If you need your laser diode chips packages, we can do that.
LDX's Proven Reliability Assurance:
Rigorous in-house qualification delivers failure rates far below industry averages across thousands of deployed units.
- Every wafer: Extensive qualification and life testing
- Every device: 100% burn-in + individual electro-optical characterization (data supplied)
- Extended options: Higher-temperature or extended burn-in, shock/vibration, prolonged life testing, environmental testing
LDX's Unmatched Customization Flexibility:
We specialize in tailored solutions from wafer to finished package, enabling exact-fit integration for unique requirements.
- Wafer/EPI: Custom wavelengths, emitter sizes, output powers
- Chip/bar design: Optimized for gain, efficiency, or specific applications
- Full add-on suite: TEC, photodiode, fiber coupling, hermetic isolation, custom optics
- Collaborative process: From inquiry through prototype to production
LDX's Secure US-Made Manufacturing
Fully manufactured in Tennessee, LDX eliminates global supply-chain risks and provides fast, secure delivery for sensitive programs.
- No tariffs, geopolitical delays, or international shipping issues
- Just-in-time delivery with buffer stock
- Guaranteed supply continuity for the life of your program (no obsolescence)
- ITAR-compliant options available
Tell us your challenges and requirements - We have a solution for you!